Diamond internal diameter saw blades (DIDB)
Diamond internal diameter saw blades (DIDB) are intended for cutting silicon ingots, complex semiconductor compounds of A3V5 group, gadolinium gallium garnets (GGG), sapphire, glass pipes and other hard and brittle nonmetal materials into wafers. Blades are thin annular discs of stainless steel sheets from 0.09 up to 0.21 mm thick. Along the internal edge a diamond-bearing layer is coated with the method of electroplating. Depending on function of the blade, the diamond-bearing layer permits to produce qualitative (parallel-sided) cut from 0.22 up to 0.70 mm.
To get a thin cut, a sheet of 0.09 mm is used. Coverage of total range of used DIDB in the world including DIDB 860 is uniqueness of production.
Skilled specialists consult about the technology of cutting sapphire, silicon, ceramics and other materials.
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Blades’ type
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Outside diameter, mm
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Cutting edge thickness, mm
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DIDB 206๕83
|
206
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0,22-0,7
|
|
DIDB 206๕118
|
206
|
|
DIDB 257๕100
|
257
|
|
DIDB 305๕100
|
305
|
|
DIDB 422๕136
|
422
|
|
DIDB 422๕152
|
422
|
|
DIDB 422๕184
|
546
|
|
DIDB 560๕203
|
560
|
|
DIDB 597๕203
|
597
|
|
DIDB 597๕235
|
597
|
|
DIDB 690๕235
|
690
|
|
DIDB 690๕235
|
690
|
|
DIDB 860๕305
|
860
|
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